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      菜單
      TTM Technologies Support
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      迅達技術學院



      Seminars & Webinars

      Upcoming Webinars

      Managing Heat with Engineered Thermal Solutions (ETS/HDVP) (English)
      April 15, 2021 | 12 noon EDT | 9 am PDT | Duration: 60-Minutes

      About this Webinar
      TTM is pioneering new thermal solutions! Our new HDVP Engineered Thermal Solutions (ETS) offer flexibility, improved performance and grounding. Compared to other technologies, HDVP enables higher PCB space utilization and is ideal for thinner printed circuit boards (15 - 25 mils or 0.38 - 0.635 mm). Join our experts as we redefine what is possible! An interactive Q&A will follow.

      Registration now open!

      Next-Gen RF/mm-Wave PCB Manufacturing & Architecture – Repeat Live Session in EU-friendly Time Zone!
      April 27, 2021 | 2 pm CEST (GMT+2) | 8 am EDT

      About this Webinar
      Back by popular demand! This live, interactive Webinar addresses both the architecture and materials necessary to meet demands faced by mm-Wave designs, including via structures, advanced etching techniques for precise tolerances, and material trade-o?s, including both dielectric and copper foil interactions. The webinar will also address parameters and tolerances needed for accurate design as well as simulation. This topic was originally presented live on March 23, 2021; for the convenience of our customers around the globe, we are offering a second, identical session.

      Registration now open!

      Previous Sessions

      PCB 101: An Introduction to Printed Circuit Board Manufacturing & Technology (Mandarin Chinese)
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      How Fabrication Process Capabilities Drive DFM Guidelines (English)
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      Materials: Selection & Performance (English)
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      Rigid-Flex (English)
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      PCB 101: An Introduction to Printed Circuit Board Manufacturing & Technology (English)
      Access the Recording
      High-Speed Backplane Design & Manufacturing Techniques (English)
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      Through Via Technology (English)
      Access the Recording
      PCB Fabrication Variables Impacting Signal Integrity (English)
      Access the Recording
      Through Via Technology (Chinese)
      Access the Recording
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