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      TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
      Networking / Communications
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      Networking & Communications

      TTM offers an integrated solution from schematic design and engineering support, to volume production and full system assembly. Our total solution provides you with the benefits of specialized facilities that meet strict telecom standards combined with cost efficient manufacturing throughout our global footprint.

      TTM is a leading supplier of complex PCBs, backplanes and assemblies, racks, subracks and indoor/outdoor enclosures to major OEM customers in the telecommunications and Networking industries.

      We fabricate low to high layer count printed circuit boards and backplanes, including large format/oversized panels and high aspect ratio plating, where we understand the importance of signal integrity and impedance control requirements. We offer world-class material and processing expertise in RF & microwave applications, including mixed material constructions, blind and buried via structures and cavity designs which are key competencies our customers rely upon.

      We are a recognized innovator in Thermal Management Solutions (TMS), and we support adhesive, sweat solder and press-fit coin attach solutions. We also support Embedded Coin Solutions, including our patent-pending E-Coin embedded copper technology and thick copper capabilities enable our customers to better design and manage applications involving high power transistors in their products.

      We have broad capabilities to provide enclosures (indoor and outdoor), backplane assembly, bus bars, and full system integration and test. This allows TTM to provide not only best-in-class pricing but also world-class manufacturing, logistics and supply chain solutions to customers across the globe. Our engineering design support teams help our customers streamline and cost-reduce their products and facilitate fast turnaround of new product introductions (NPI), meeting our customers' ever-important time-to-market requirements.

      Our key telecommunications global manufacturing facilities are TL9000 certified and provide our customers with the highest levels of technology and quality.