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      TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
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      Conventional PCBs

      Conventional PCBs can be any layer count, but rely on conventional drilling and plating technology.

      • Multilayer up to 60+ layers
      • Wide range of laminate options including high temperature, low loss and lead-free laminates
      • Mixed dielectric (hybrid) constructions
      • Panel size up to 30"x 55"
      • Embedded coin, or metal core and metal backed MLB
      • Panel thickness up to .450"
      • RF and microwave circuits
      • Heavy copper (10 oz. outer layer / 5 oz.
        inner layer)
      • Embedded, distributed and discrete passive components
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