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      TTM is pleased to announce the name change of its Wireless BU. Effective January 1, 2021, Wireless BU is now named RF & Specialty Components BU (RF&S) to better reflect the developing nature of this BU and TTM's intention to support our customers with broad based high performance engineered component solutions.
      TTM Products
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      RF & Microwave PCBs

      TTM applications based approach provides innovative engineering and advanced process capabilities.

      From defense/aerospace electronics, medical devices and imaging, or complex telecommunications equipment, TTM supports a wide range of frequency bands (L, S, C, X, Ku, K, Ka, V, W). We have extensive experience with a wide range of low loss laminates and a total of over 70 resin systems.

      Our Field Applications Engineering team provides a long history of collaborative engineering support. Qualifications include MIL-PRF-31032, AS 9100, ITAR, IPC 6012 & IPC6018, NADCAP.

      Our Capabilities Include:

      Tight Etch Tolerances on Critical RF Features

      • +/- .0005" standard tolerance on etched features for unplated 0.5oz copper
      • Selective plated up layers allowing +/- .0005" etch tolerances
      • Exact registration/laser direct imaging
      • Front to back registration of etched cores to +/-.001"
      • Mixed Dielectric constructions
      • Buried / Blind / Microvia
      • Ormet interconnects
      • Multilevel cavity constructions
      • Optical mill / drill
      • Laser routing
      • Sequential lamination
      • Formed PCB'S
      • Plated edges

      Back Drill for Precision Stub Removal

      • Mechanical back-drilling (Minimal stub)
      • Laser drilling (No stub)
      • Laser modified controlled depth drill (Mechanical drill followed by laser cleanup, no stub)

      Hole Fill

      • Conductive, nonconductive, and partial hole fill options

      Thermal Solutions

      • Copper coins and slugs
      • Metal Core & Metal Back
      • Thermally conductive laminates
      • Heatsink assembly department to laminate heatsink or interface plates to the circuit boards

      Embedded Capabilities

      • Planar Resistors
        • Ohmega and Ticer
        • Screened Ink Resistors
      • Circulators
        • On board circuit
        • Embedded ferrites

      Surface Finishes

      • ENIG – electroless nickel, soft immersion gold – standard solder assemblies
      • ENEPIG - electroless nickel, electroless palladium, immersion gold
      • Hard and soft wirebondable gold
      • Immersion silver

      Assembly and Test

      • RF assembly of connector, surface mount component, drop-in cavity components, hand and automated solder assembly options
      • RF test center including 6 Network analyzers with combined frequency sweep coverage of 50MHz to 40GHz.
      • Custom anechoic boxes for antenna measurements
      • Switch matrix capability for multiple measurements between human interaction